Process Engineer III

Iron Systems is an innovative, customer-focused provider of custom-built computing infrastructure platforms such as network servers, storage, OEM/ODM appliances & embedded systems. For more than 15 years, customer have trusted us for our innovative problem solving combined with holistic design, engineering, manufacturing, logistic and global support services.



Job Description:

Utilize various manufacturing methods (i.e. laser patterning, screen printing, electrodeposition, pick-and-place, lamination bonding, etc.) to build-up complex flexible and stretchable electronics devices

Identify materials, including laminate films, base-resins, solder-pastes, encapsulants and inks, for printed and patterned soft electronics and manufacturing prototypes.

Develop process for printing interconnects, traces and encapsulation

Run characterization manufactured test samples for mechanical and electrical properties

Collaborate with other researchers and engineers to prototype hardware solutions and run experiments to advance the project.

Purpose/Size of this team:

Support EMG2 band built and related stretchable interconnect research

Reason for the request:

prototype and test vehicle fabrication; Mechanical interconnect between stretchable traces and FPC design; bonding jigs design & fab for bonding FPC to stretchable traces ; soft microfludics channels

Top 3 must-have HARD skills:

1. 3+ years of experience in manufacturing prototypes, in the field of printed electronics.

2. Experience with various manufacturing methods, such as screen printing, ink jetting slot die coating and molding .

3. Ability to use CAD software to develop models of test infrastructure, prototype parts, and assemble test



Good to have skills:

1. Experience with liquid metal printing or other soft materials processing

2. Experience with electrical system testing and troubleshooting.

3. Experience with lamination , microblfab, soft microfludics fabrication.



Experience:

3+ years of experience in manufacturing prototypes, ideally in the field of printed electronics.

Experience with various manufacturing methods, such as screen printing, ink jetting and slot die coating.

Ability to use CAD software to develop models of test infrastructure, prototype parts, and assemble test

Experience collaborating and communicating effectively in team settings.

Experience with electrical system testing and troubleshooting.

Experience in material characterization skills like SEM, UV scattering, and other metrology tools Design.

Experience with material compounding

Qualification:

BS in Mechanical Engineering, electrical engineer, or material science