Heterogeneous Platforms Lab Research Intern
Intel
Sacramento, California
platforms
research
intern
intel
research
die
design
integration
circuits
modeling
identifying
engineering
government
January 12, 2023
Intel
Sacramento, California
**Job Description**
This is a 3-month internship position in Intel's Heterogeneous Platforms Research Lab. Candidate will be contributing to Intel's multi-die integration research. Research activities include research and design of memory blocks, memory interfaces, clocking and IO circuits.
The research will also involve die-package interface simulations with modeling of new die attachment technologies.
**Qualifications**
You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences
**Minimum qualifications:**
The Candidate must be pursuing a Ph.D. degree in Electrical Engineering, Computer Engineering or a related field.
**6+ months of work or educational experience in the following areas:**
+ Circuit and interconnect modeling and simulation
+ Clock generation and distribution
+ Physical design
+ Complementary Metal-Oxide Semiconductor (CMOS) chip design.
**Preferred qualifications:**
+ Experience in multi-die stacking.
+ Experience with 3D integration technology, interface circuits and lab measurements.
**Inside this Business Group**
Intel Labs is the company's world-class, industry leading research organization, responsible for driving Intel's technology pipeline and creating new opportunities. The mission of Intel Labs is to deliver breakthrough technologies to fuel Intel's growth. This includes identifying and exploring compelling new technologies and high risk opportunities ahead of business unit investment and demonstrating first-to-market technologies and innovative new usages for computing technology. Intel Labs engages the leading thinkers in academia and industry in addition to partnering closely with Intel business units.
**Covid Statement**
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.
**Posting Statement**
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
**Benefits**
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here:
**Working Model**
This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. **In certain circumstances the work model may change to accommodate business needs.**
This is a 3-month internship position in Intel's Heterogeneous Platforms Research Lab. Candidate will be contributing to Intel's multi-die integration research. Research activities include research and design of memory blocks, memory interfaces, clocking and IO circuits.
The research will also involve die-package interface simulations with modeling of new die attachment technologies.
**Qualifications**
You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences
**Minimum qualifications:**
The Candidate must be pursuing a Ph.D. degree in Electrical Engineering, Computer Engineering or a related field.
**6+ months of work or educational experience in the following areas:**
+ Circuit and interconnect modeling and simulation
+ Clock generation and distribution
+ Physical design
+ Complementary Metal-Oxide Semiconductor (CMOS) chip design.
**Preferred qualifications:**
+ Experience in multi-die stacking.
+ Experience with 3D integration technology, interface circuits and lab measurements.
**Inside this Business Group**
Intel Labs is the company's world-class, industry leading research organization, responsible for driving Intel's technology pipeline and creating new opportunities. The mission of Intel Labs is to deliver breakthrough technologies to fuel Intel's growth. This includes identifying and exploring compelling new technologies and high risk opportunities ahead of business unit investment and demonstrating first-to-market technologies and innovative new usages for computing technology. Intel Labs engages the leading thinkers in academia and industry in addition to partnering closely with Intel business units.
**Covid Statement**
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.
**Posting Statement**
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
**Benefits**
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here:
**Working Model**
This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. **In certain circumstances the work model may change to accommodate business needs.**
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